K4A8G165WC-BCWE Samsung 8Gb DDR4 SDRAM
Samsung K4A8G165WC-BCWE is a 8Gb x16 DDR4 SDRAM component. Samsung lists this ordering family in its DDR4 component guide for PC/server memory configurations.
Availability, quantity and lead time are confirmed in your quotation.
K4A8G165WC-BCWE Specifications
Basic specifications
- Manufacturer
- Samsung
- Complete part number
- K4A8G165WC-BCWE
- Memory type
- DDR4 SDRAM
- Component density
- 8Gb
- Organization
- 512M x16
- Data bus width
- x16
Speed & electrical
- WE speed designation
- 3200 MT/sWE code as defined by Samsung’s ordering guide.
- Clock
- 1600 MHzDDR transfer rate / 2; WE designation.
- VDD / VDDQ
- 1.2 V
Package & temperature
- Package
- 96-ball FBGA
- Temperature grade
- Commercial (C)
- Body size
- 7.50 ±0.10 × 13.30 ±0.10 mmW × L · original 8Gb C-die x16 outline.
- Overall height
- 1.10 ±0.10 mmManufacturer outline, including its stated tolerance.
- Ball pitch
- 0.80 mmPitch dimensioned on both axes.
Technical notes & sources
Manufacturer declaration: Samsung’s March 2025 declaration covers all Samsung memory products placed on the European Community market by Samsung and its subsidiaries under Directive 2011/65/EU. The ten listed substance limits are 0.1% by weight in homogeneous materials (cadmium: 0.01%), subject to applicable exemptions, including examples 7(a) and 7(c)-I. This is a manufacturer product-class declaration, not a lot-specific certificate.
Manufacturer sources: Samsung DDR4 product guide · May 2018 · Samsung EU RoHS declaration · March 2025
K4A8G165WC-BCWE Datasheet
Specification review: 2026-11-01 · Related-part update: 2026-11-02.
8Gb C-die x16 · 96-ball FBGA · dimensions in mm Manufacturer drawing, not a product photo.
Selection notes
What does BCWE identify?
K4A8G165WC-BCWE combines Samsung’s B code for flip-chip FBGA, C commercial-temperature code and WE DDR4-3200 speed designation. The preceding W identifies the 1.2 V / 1.2 V POD interface, and C identifies the C-die generation in this ordering family. Retain the complete BCWE code in the BOM and RFQ.
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