H5AN8G6NAFR-UHC SK hynix 8Gb DDR4 SDRAM
SK hynix H5AN8G6NAFR-UHC is an 8Gb x16 DDR4 SDRAM component. SK hynix describes the covered AFR family for main-memory applications requiring high density and bandwidth. This x16 configuration has eight banks in two bank groups.
Availability, quantity and lead time are confirmed in your quotation.
H5AN8G6NAFR-UHC Specifications
Basic specifications
- Manufacturer
- SK hynix
- Complete part number
- H5AN8G6NAFR-UHC
- Memory type
- DDR4 SDRAM
- Component density
- 8Gb
- Organization
- 512M x16
- Data bus width
- x16
Speed & electrical
- Data rate
- 2400 MT/s
- Clock
- 1200 MHz
- CL / tRCD / tRP
- 17-17-17Native speed; full limits and modes in Technical notes.
- VDD / VDDQ
- 1.2 V
- VDD / VDDQ operating range
- 1.14–1.26 V
- VPP
- 2.5 VOperating range:2.375–2.750 V.
Package & temperature
- Package
- 96-ball FBGA
- Body size
- 7.50 ±0.10 × 13.00 ±0.10 mmW × L; manufacturer tolerances.
- Overall height
- 1.10 ±0.10 mm
- Ball pitch
- 0.80 mmDimensioned on both axes.
- Temperature option
- 0–95 °C case option
- Normal case range
- 0 to +85 °CMeasured at top center of the case.
- Extended case range
- >85 to +95 °CAdditional refresh/self-refresh conditions apply.
Technical notes & sources
Native timing. At DDR4-2400: 0.833 ≤ tCK < 0.937 ns; CL17, CWL12 or 16. tAA14.16–18 ns; tRCD and tRP ≥14.16 ns; tRAS ≥32 ns and ≤9 × tREFI; tRC ≥46.16 ns. DLL enabled, gear-down disabled. Read DBI is not asserted for this x16 device.
Supply conditions. VDDQ must be ≤VDD and track VDD; AC characterization ties the two rails. The DC bandwidth is20 MHz. Keep VDD/VDDQ within300 mV, VREFCA ≤0.6 × VDDQ (≤300 mV when both rails are below500 mV), and VPP ≥VDD/VDDQ. Absolute-maximum ratings are stress limits.
Temperature and refresh. Average tREFI is7.8 µs below85 °C and3.9 µs from85 through95 °C; use the shorter interval at the overlapping85 °C boundary. High-temperature self-refresh requires either manual extended mode MR2 A6=0, A7=1 or the specified optional automatic mode A6=1, A7=0. Do not assume the optional1x-refresh extension or a different device’s register settings.
Manufacturer declaration: The SK hynix AFR datasheet declares the covered component family Lead-Free, Halogen-Free and RoHS compliant. No specific lot certificate, REACH statement or finished-system approval is asserted.
Manufacturer sources: SK hynix 8Gb AFR DDR4 Datasheet · Rev. 1.2
H5AN8G6NAFR-UHC Datasheet
Specification review: 2026-11-02 · Related-part update: 2026-11-02.
96-ball FBGA · 7.50 ±0.10 × 13.00 ±0.10 mm Manufacturer drawing, not a product photo.
Selection notes
Using the device near its upper temperature limit?
Qualify the controller’s high-temperature refresh behavior as case temperature reaches 85°C. Use the shorter 3.9 µs interval through 95°C, and configure manual extended-temperature self-refresh or verify support for the documented optional automatic mode. Confirm the selected mode in firmware.
Evaluating an x8 part for this x16 design?
This device supplies a 16-bit data interface. An x8 candidate changes the number of data bits supplied by each device, so review device count, controller organization and board wiring before selecting it. Use the candidate’s own ball map when checking the footprint.
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