MT40A1G16TB-062E IT:F Micron 16Gb DDR4 SDRAM
Micron MT40A1G16TB-062E IT:F is a 16Gb x16 DDR4 SDRAM component. Provides synchronous volatile read/write memory through an 8n-prefetch DDR4 interface, transferring two data words per clock at the I/O pins.
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MT40A1G16TB-062E IT:F Specifications
Basic specifications
- Manufacturer
- Micron
- Complete part number
- MT40A1G16TB-062E IT:F
- Memory type
- DDR4 SDRAM
- Component density
- 16Gb
- Organization
- 1G x16
- Data bus width
- x16
Speed & electrical
- Data rate
- 3200 MT/s
- Clock
- 1600 MHzDDR transfer rate / 2; nominal clock.
- Timing
- 22-22-22CL-nRCD-nRP · native bin, read DBI disabled; mode-dependent values below.
- VDD / VDDQ
- 1.2 V
- VDD / VDDQ operating range
- 1.14–1.26 VEach rail; VDDQ ≤ VDD and must track VDD.
- VPP supply
- 2.5 VOperating range 2.375–2.750 V; sequencing and noise conditions below.
Package & temperature
- Package
- 96-ball TFBGA
- Body size
- 7.5 ±0.1 × 13.0 ±0.1 mmW × L · manufacturer outline dimensions.
- Overall height
- 1.1 ±0.1 mmManufacturer outline; retain the stated tolerance.
- Ball pitch
- 0.8 mmTYP in the Micron outline.
- Temperature grade
- Industrial (IT)
- Normal case temperature
- −40 to +85 °CTC measured on the top-center case surface.
- Extended case temperature
- Above +85 to +95 °C2× refresh above 85 °C.
Technical notes & sources
Native speed-bin conditions At the native -062E DDR4-3200 bin, 0.625 ns ≤ tCK(AVG) < 0.682 ns; CL 22 without read DBI, CL 26 with read DBI, and CWL 16 or 20. Without read DBI, tAA is 13.75–19.00 ns; read DBI adds 4nCK to both tAA limits. tRCD and tRP are at least 13.75 ns, tRAS is at least 32 ns and at most 9 × tREFI; tRC minimum is tRAS + tRP = 45.75 ns. These speed-bin settings require DLL enabled. A 2tCK WRITE preamble requires CWL at least one clock above the lowest setting for the tCK range; programmed CWL must not exceed CL. Do not combine rounded clock settings in a way that violates tRAS or tRP.
Supply operating conditions VDDQ must not exceed VDD and must track it; AC parameters are measured with both rails tied. VDD slew is 0.004–600 V/ms between 300 mV and 80% of minimum VDD (20 MHz measurement bandwidth), with 300 mV to minimum VDD ramp no longer than 200 ms. Stable DC levels (0–250 kHz) must remain within the operating ranges. After changing a stable rail set point following initialization, repeat DLL reset and calibrations. AC noise above 250 kHz is limited to ±60 mV on VDD/VDDQ and ±120 mV on VPP without crossing the operating limits. The separate stress/sequencing notes also require VDD and VDDQ within 300 mV, VREF no greater than 0.6 × VDDQ (up to 300 mV when both supplies are below 500 mV), and VPP no lower than VDD/VDDQ while powered.
Temperature, refresh and self-refresh The exact Industrial (IT) part covers case TC −40 to +95 °C. Normal operation extends through 85 °C. 2× refresh above 85 °C. Use the corresponding high-temperature self-refresh option above 85 °C. Below 0 °C, ODT resistance and I/O impedance must be derated. The 8192-cycle refresh windows are 64 ms through 85 °C, 32 ms above 85 to 95 °C.
Manufacturer declaration: Micron’s exact-part component declaration states compliance with RoHS Directive 2011/65/EU and amendment (EU) 2015/863. This component-level statement does not certify a supplied lot.
Manufacturer sources: Micron exact-part catalog · Micron 16Gb DDR4 Datasheet · Rev. H · Micron exact-part RoHS declaration
MT40A1G16TB-062E IT:F Datasheet
Specification review: 2026-11-01 · Related-part update: 2026-11-02.
TB 96-ball FBGA · dimensions in mm Manufacturer drawing, not a product photo.
Selection notes
What does the complete ordering code identify?
MT40A1G16TB-062E IT:F identifies 1G x16, the TB package and die revision F. -062E is the DDR4-3200 speed bin (0.625 ns at CL 22 without read DBI). The exact IT suffix must be retained, with its industrial (it) case-temperature option. Preserve all punctuation and suffix characters in the BOM and RFQ.
Which temperature conditions apply?
Industrial (IT): case TC −40 to +95 °C. 2× refresh above 85 °C. Self-refresh settings and the detailed technical notes also apply.
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