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H26M51002KPR SK hynix 16GB eMMC 5.1

H26M51002KPR is a SK hynix 16GB managed NAND device with an eMMC 5.1 HS400 interface in a 153-ball FBGA package. Its embedded controller manages wear levelling, bad blocks, garbage collection and ECC.

In Stock41,460 pcs available

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H26M51002KPR Specifications

Basic specifications

Manufacturer
SK hynix
Part number
H26M51002KPR
Memory type
eMMC 5.1 managed NAND
Capacity
16GB
NAND stack
128Gb × 1
Data bus width
1 / 4 / 8-bitHS400 requires the 8-bit bus.

Interface & electrical

HS400 interface rate
Up to 400 MB/sBus interface limit, not guaranteed flash read/write speed.
Interface clock
0–200 MHzBoot clock: 0–52 MHz; operating mode limits apply.
VCC operating range
2.7–3.6 VNAND supply; not the I/O rail.
VCCQ operating range
1.7–1.95 VController / I/O supply; HS400 uses the 1.8 V interface.
HS400 requirements
8-bit · 1.8 V VCCQUse the documented mode-selection sequence.
Characterized sequential R/W
250 / 45 MB/sDevice-level HS400, 512 KB chunks, cache on; not 100% tested. Not a guaranteed minimum.

Package & temperature

Package
153-ball FBGA
Body dimensions
11.50 × 13.00 mmW × L; each dimension ±0.10 mm.
Overall height
0.70 ±0.10 mmMaximum 0.80 mm; lineup uses the 0.8 mm package designation.
Ball pitch
0.50 mm
Non-operating storage
−40°C to +85°CStorage rating is not the operating range.
Technical notes & sources

Interface and throughput. HS400 is an 8-bit, 1.8 V VCCQ interface operating up to a 200 MHz DDR clock and 400 MB/s bus rate. The separate sequential performance table uses device-level measurements, 512 KB chunks and cache enabled, and is marked not 100% tested; it is not an allocation or performance guarantee.

Power and mode selection. VCC is 2.7–3.6 V and VCCQ is 1.7–1.95 V. Do not issue commands until both supplies are stable. Follow the documented HS400 transition sequence; DDR4 CL, VPP and refresh values do not describe this eMMC device.

Package. Figure 2 gives a total height of 0.70 ±0.10 mm (0.80 mm maximum), while the lineup names the 0.8 mm package.

Manufacturer declaration: The SK hynix e-NAND datasheet states compliance with the RoHS directive.

SK hynix H26M51002KPR 153-ball FBGA package drawing showing top, bottom and side views, 11.5 × 13.0 mm body and 0.5 mm ball pitch.

H26M51002KPR Datasheet

Rev. 1.0 · September 2017 · PDF · 2.77 MB

Document review: 2026-10-23 · Related-part update: 2026-10-24

153-ball FBGA · 11.5 × 13.0 mm body · 0.5 mm ball pitch. Manufacturer drawing, not a product photo.

Selection notes

How does H26M51002KPR differ from H26M62002JPR?

H26M51002KPR is the 16GB, 128Gb × 1 NAND-stack part. H26M62002JPR is the 32GB, 128Gb × 2 part. Both use the listed 153-ball, 11.5 × 13.0 mm package.

Compare related partsRelated parts

Does HS400 mean 400 MB/s flash read speed?

No. 400 MB/s is the documented HS400 bus-interface limit, not a guaranteed NAND read/write rate. HS400 requires an 8-bit bus and 1.8 V VCCQ; use the separate characterized performance figures with their stated test conditions.

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