MT40A512M16LY-075:E Micron 8Gb DDR4 SDRAM
Micron MT40A512M16LY-075:E is an 8Gb x16 DDR4 SDRAM component. This synchronous DDR4 component uses an 8n-prefetch architecture. Its controller configuration, electrical conditions and package must match the complete ordering code.
Availability, quantity and lead time are confirmed in your quotation.
MT40A512M16LY-075:E Specifications
Basic specifications
- Manufacturer
- Micron
- Complete part number
- MT40A512M16LY-075:E
- Memory type
- DDR4 SDRAM
- Component density
- 8Gb
- Organization
- 512M x16
- Data bus width
- x16
Speed & electrical
- Data rate
- 2666 MT/s
- Clock
- 1333 MHz
- CL / tRCD / tRP
- 19-19-19Native speed; limits and modes below.
- VDD / VDDQ
- 1.2 V
- VDD / VDDQ operating range
- 1.14–1.26 V
- VPP
- 2.5 VOperating range: 2.375–2.750 V.
Package & temperature
- Package
- 96-ball TFBGA
- Temperature option
- Commercial
- Body size
- 7.50 ±0.10 × 13.50 ±0.10 mmW × L; manufacturer tolerances.
- Body height
- 1.10 ±0.10 mm
- Ball pitch
- 0.80 mm
- Normal case range
- 0 to +85 °CMeasured at top center of the package.
- Extended case range
- >85 to +95 °CAdditional refresh and self-refresh conditions apply.
Technical notes & sources
Native timing. At DDR4-2666: 0.750 ≤ tCK < 0.833 ns; CL19, CWL 14 or 18. tAA 14.25–19 ns; tRCD and tRP ≥14.25 ns; tRAS ≥32 ns and ≤9 × tREFI; tRC ≥46.25 ns. DLL enabled. Read DBI uses CL22; add 3nCK to the tAA limits. CWL must not exceed CL; the 2tCK write preamble requires CWL at least one clock above the lowest valid setting. Preserve time minima when converting tRAS and tRP to tRC clock counts.
Supply conditions. VDDQ must be ≤VDD and track VDD; AC characterization ties the rails. Keep VDD/VDDQ within 300 mV, VREFCA ≤0.6 × VDDQ (≤300 mV when both rails are below 500 mV), and VPP ≥VDD/VDDQ when powered. Absolute-maximum ratings are stress limits.
Power and rail limits. Between 300 mV and 80% of minimum VDD, keep VDD slew at 0.004–600 V/ms using a 20 MHz band-limited measurement. Reach minimum VDD from 300 mV within 200 ms. Stable DC levels (0–250 kHz) and AC noise must remain inside the operating ranges. Above 250 kHz, permitted noise is ±60 mV for VDD/VDDQ and ±120 mV for VPP. A DC-level change after initialization requires DLL reset and calibration.
Temperature and refresh. In 1x refresh-command mode, nominal tREFI is 7.8 µs. The temperature text requires at least double refresh above 85 °C. At exact temperature boundaries, Table 52 has overlapping inclusive ranges. Using the shorter listed interval is a conservative engineering choice, not a resolved manufacturer requirement; confirm the boundary behavior before relying on the longer interval. For extended-temperature self refresh, select manual extended mode MR2[7:6]=10 or the supported automatic mode =11. Thermal scaling is separate from 2x/4x fine-granularity refresh. This exact commercial ordering code ends at 95 °C; higher family temperature options are not inherited.
Manufacturer declaration: Micron’s exact-part certificate lists MT40A512M16LY-075:E as compliant with EU RoHS 2011/65/EU and 2015/863/EU under its stated conditions. This does not certify a supplied lot or a finished system.
Manufacturer sources: Micron 8Gb DDR4 Datasheet · Micron MT40A512M16LY-075:E exact-part catalog · Micron MT40A512M16LY-075:E RoHS certificate
MT40A512M16LY-075:E Datasheet
Specification review: 2026-11-06 · Related-part update: 2026-11-06.
96-ball TFBGA · 7.50 ±0.10 × 13.50 ±0.10 mm Manufacturer drawing, not a product photo.
Selection notes
Can -075 and -075E be treated as equivalent ordering codes?
No. They have separate columns in the speed-bin table, so a matching nominal data rate does not establish the same latency requirements. Preserve -075:E in the RFQ and compare any proposed suffix change against the actual controller setup. Do not remove the speed-bin letter or the die revision as if it were only a formatting difference.
Can this commercial part use the family’s higher-temperature limits?
No. Select the thermal limit for this exact ordering code, then apply the refresh and self-refresh conditions for its allowed case-temperature band. A wider range elsewhere in the family document belongs to other options and does not extend this part’s qualification. Check the package case temperature under load when deciding whether this code suits the application.
Does another 96-ball package establish a mechanical match?
No. Check the proposed part’s package drawing against the LY outline and the existing land pattern, including dimensions, pitch and ball assignment. Keep that mechanical review separate from a speed comparison. A part can match the requested density and speed while still requiring a different package or board layout.
What should be checked before accepting an available alternative?
Because this exact code is listed as obsolete, ask the supplier to identify the proposed alternate in full. Compare its speed suffix, die revision, temperature option and package against the approved BOM, then obtain engineering approval for any change. Keep the original requirement and the alternate distinct in the quotation so availability does not silently redefine the requested part.
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