MT40A512M16JY-083E AAT:B Micron 8Gb DDR4 SDRAM
Micron MT40A512M16JY-083E AAT:B is an 8Gb x16 DDR4 SDRAM component. This synchronous DDR4 component uses an 8n-prefetch architecture. Its controller configuration, electrical conditions and package must match the complete ordering code.
Availability, quantity and lead time are confirmed in your quotation.
MT40A512M16JY-083E AAT:B Specifications
Basic specifications
- Manufacturer
- Micron
- Complete part number
- MT40A512M16JY-083E AAT:B
- Memory type
- DDR4 SDRAM
- Component density
- 8Gb
- Organization
- 512M x16
- Data bus width
- x16
Speed & electrical
- Data rate
- 2400 MT/s
- Clock
- 1200 MHz
- CL / tRCD / tRP
- 16-16-16Native speed; limits and modes below.
- VDD / VDDQ
- 1.2 V
- VDD / VDDQ operating range
- 1.14–1.26 V
- VPP
- 2.5 VOperating range: 2.375–2.750 V.
Package & temperature
- Package
- 96-ball TFBGA
- Temperature option
- Automotive (AAT)
- Body size
- 8.00 ±0.10 × 14.00 ±0.10 mmW × L; manufacturer tolerances.
- Body height
- 1.10 ±0.10 mm
- Ball pitch
- 0.80 mm
- Normal case range
- −40 to +85 °CMeasured at top center of the package.
- Extended case range
- >85 to +105 °CAdditional refresh and self-refresh conditions apply.
Technical notes & sources
Native timing. At DDR4-2400: 0.833 ≤ tCK < 0.937 ns; CL16, CWL 12 or 16. tAA 13.32–19 ns; tRCD and tRP ≥13.32 ns; tRAS ≥32 ns and ≤9 × tREFI; tRC ≥45.32 ns. DLL enabled. Read DBI uses CL19; add 3nCK to the tAA limits. CWL must not exceed CL; the 2tCK write preamble requires CWL at least one clock above the lowest valid setting. Preserve time minima when converting tRAS and tRP to tRC clock counts.
Supply conditions. VDDQ must be ≤VDD and track VDD; AC characterization ties the rails. Keep VDD/VDDQ within 300 mV, VREFCA ≤0.6 × VDDQ (≤300 mV when both rails are below 500 mV), and VPP ≥VDD/VDDQ when powered. Absolute-maximum ratings are stress limits.
Power and rail limits. Between 300 mV and 80% of minimum VDD, keep VDD slew at 0.004–600 V/ms using a 20 MHz band-limited measurement. Reach minimum VDD from 300 mV within 200 ms. Stable DC levels (0–250 kHz) and AC noise must remain inside the operating ranges. Above 250 kHz, permitted noise is ±60 mV for VDD/VDDQ and ±120 mV for VPP. A DC-level change after initialization requires DLL reset and calibration.
Temperature and refresh. In 1x refresh-command mode, nominal tREFI is 7.8 µs. The temperature text requires at least double refresh above 85 °C and quadruple refresh above 95 °C. At exact temperature boundaries, Table 52 has overlapping inclusive ranges. Using the shorter listed interval is a conservative engineering choice, not a resolved manufacturer requirement; confirm the boundary behavior before relying on the longer interval. For extended-temperature self refresh, select manual extended mode MR2[7:6]=10 or the supported automatic mode =11. Thermal scaling is separate from 2x/4x fine-granularity refresh. Below 0 °C, apply I/O impedance and ODT derating. The AAT option ends at 105 °C; UT limits are not inherited.
Manufacturer declaration: Micron’s exact-part certificate lists MT40A512M16JY-083E AAT:B as compliant with EU RoHS 2011/65/EU and 2015/863/EU under its stated conditions. This does not certify a supplied lot or a finished system.
Manufacturer sources: Micron 8Gb Automotive DDR4 Datasheet · Micron MT40A512M16JY-083E AAT:B exact-part catalog · Micron MT40A512M16JY-083E AAT:B RoHS certificate
MT40A512M16JY-083E AAT:B Datasheet
Specification review: 2026-11-06 · Related-part update: 2026-11-06.
96-ball TFBGA · 8.00 ±0.10 × 14.00 ±0.10 mm Manufacturer drawing, not a product photo.
Selection notes
Does the automotive temperature option cover a cold-start design automatically?
The temperature option alone is not enough to approve the board. Below 0 °C, the datasheet requires I/O-impedance and ODT derating, so review termination and controller settings for the cold operating condition. Keep AAT:B in the purchasing specification and validate the intended startup and operating sequence rather than relying only on the minimum temperature printed in a table.
Can a high-temperature design keep its normal refresh settings?
No. Select refresh and self-refresh settings for the actual case-temperature band; the applicable intervals become shorter as temperature rises. Apply the boundary conditions in Technical notes when configuring the controller. Keep the AAT ordering-code limit separate from the family’s higher-temperature options, and test both active operation and sleep rather than checking only a maximum-temperature label.
Can another 96-ball x16 part use the same PCB footprint?
Check its drawing against the JY package before deciding. Match the body outline, land pattern, ball assignment and assembly clearance, then review electrical conditions separately. A shared ball count and x16 label do not establish that a different package code will fit the same board or preserve the same signal connections.
How should an obsolete-part alternate be handled?
The exact catalog lists this ordering code as obsolete, so identify the offered alternate explicitly before accepting a substitution. Compare its automotive option, package and operating requirements with the qualified BOM, and route differences through the engineering change process. Availability of a similar family member is a sourcing lead, not approval to exchange the parts in a released design.
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