MT40A2G8SA-062E:F Micron 16Gb DDR4 SDRAM
Micron MT40A2G8SA-062E:F is a 16Gb x8 DDR4 SDRAM component. This synchronous DDR4 component uses an 8n-prefetch architecture. Its controller configuration, electrical conditions and package must match the complete ordering code.
Availability, quantity and lead time are confirmed in your quotation.
MT40A2G8SA-062E:F Specifications
Basic specifications
- Manufacturer
- Micron
- Complete part number
- MT40A2G8SA-062E:F
- Memory type
- DDR4 SDRAM
- Component density
- 16Gb
- Organization
- 2G x8
- Data bus width
- x8
Speed & electrical
- Data rate
- 3200 MT/s
- Clock
- 1600 MHz
- CL / tRCD / tRP
- 22-22-22Native speed; limits and modes below.
- VDD / VDDQ
- 1.2 V
- VDD / VDDQ operating range
- 1.14–1.26 V
- VPP
- 2.5 VOperating range: 2.375–2.750 V.
Package & temperature
- Package
- 78-ball TFBGA
- Temperature option
- Commercial
- Body size
- 7.50 ±0.10 × 11.00 ±0.10 mmW × L; manufacturer tolerances.
- Body height
- 1.10 ±0.10 mm
- Ball pitch
- 0.80 mm
- Normal case range
- 0 to +85 °CMeasured at top center of the package.
- Extended case range
- >85 to +95 °CAdditional refresh and self-refresh conditions apply.
Technical notes & sources
Native timing. At DDR4-3200: 0.625 ≤ tCK < 0.682 ns; CL22, CWL 16 or 20. tAA 13.75–19 ns; tRCD and tRP ≥13.75 ns; tRAS ≥32 ns and ≤9 × tREFI; tRC ≥45.75 ns. DLL enabled. Read DBI uses CL26; add 4nCK to the tAA limits. CWL must not exceed CL; the 2tCK write preamble requires CWL at least one clock above the lowest valid setting. Preserve time minima when converting tRAS and tRP to tRC clock counts.
Supply conditions. VDDQ must be ≤VDD and track VDD; AC characterization ties the rails. Keep VDD/VDDQ within 300 mV, VREFCA ≤0.6 × VDDQ (≤300 mV when both rails are below 500 mV), and VPP ≥VDD/VDDQ when powered. Absolute-maximum ratings are stress limits.
Power and rail limits. Between 300 mV and 80% of minimum VDD, keep VDD slew at 0.004–600 V/ms using a 20 MHz band-limited measurement. Reach minimum VDD from 300 mV within 200 ms. Stable DC levels (0–250 kHz) and AC noise must remain inside the operating ranges. Above 250 kHz, permitted noise is ±60 mV for VDD/VDDQ and ±120 mV for VPP. A DC-level change after initialization requires DLL reset and calibration.
Temperature and refresh. In 1x refresh-command mode, nominal tREFI is 7.8 µs. The temperature text requires at least double refresh above 85 °C. At exact temperature boundaries, Table 52 has overlapping inclusive ranges. Using the shorter listed interval is a conservative engineering choice, not a resolved manufacturer requirement; confirm the boundary behavior before relying on the longer interval. For extended-temperature self refresh, select manual extended mode MR2[7:6]=10 or the supported automatic mode =11. Thermal scaling is separate from 2x/4x fine-granularity refresh. This exact commercial ordering code ends at 95 °C; higher family temperature options are not inherited.
Manufacturer declaration: Micron’s exact-part certificate lists MT40A2G8SA-062E:F as compliant with EU RoHS 2011/65/EU and 2015/863/EU under its stated conditions. This does not certify a supplied lot or a finished system.
Manufacturer sources: Micron 16Gb DDR4 Datasheet · Micron MT40A2G8SA-062E:F exact-part catalog · Micron MT40A2G8SA-062E:F RoHS certificate
MT40A2G8SA-062E:F Datasheet
Specification review: 2026-11-06 · Related-part update: 2026-11-06.
78-ball TFBGA · 7.50 ±0.10 × 11.00 ±0.10 mm Manufacturer drawing, not a product photo.
Selection notes
Can an existing lower-density x8 memory setup be retained?
Check the controller’s supported density and address mapping before doing so. A shared x8 bus does not establish the same row addressing, capacity configuration or refresh timing. Use this exact device’s addressing and refresh tables when updating initialization, then validate the resulting memory map on the board rather than treating the change as a part-number-only BOM edit.
Can read DBI be enabled without changing the latency setup?
Do not toggle it independently of the timing configuration. Check the speed-bin row’s DBI latency together with CL, CWL and the selected write-preamble mode. The specified combinations and DLL-enabled conditions must remain valid after the change. This prevents a controller feature setting from silently making an otherwise valid speed configuration inconsistent.
Is an ambient-temperature limit enough for thermal qualification?
No. The operating limit is based on the package’s center-top case temperature. Check that temperature under the intended load and cooling conditions, and verify the controller’s refresh and self-refresh behavior in the extended band. An acceptable room or enclosure temperature does not by itself establish that the device’s case-temperature conditions are met.
Is a nominal 1.2 V supply enough to approve the power design?
No. Check the actual rail ranges and relationships during ramp-up as well as steady operation, including VPP and VDDQ tracking. If the design changes a rail’s DC level after initialization, the specified reset and calibration requirements also matter. Review those operating conditions before reusing a power sequence designed for a different memory device.
How to request a quote
Four required fields. Other preferences are optional.
Exact part & quantity
Check the complete MPN in this RFQ. Add your name, email, quantity and destination.
Optional requirements
Add your requirements if needed. Multiple parts can also be sent by email.
Written quotation
Offered quantity, lead time and commercial terms are confirmed in writing. An enquiry does not reserve stock.
Why DramTrade.com?
One Connection. A World of Memory Supply.
From high-demand memory to hard-to-find parts, DramTrade helps you find the supply you need.
Exact Parts, Clear Details
Confirm the complete part number, condition, date codes and packaging before ordering.
Clear Supply & Quote Terms
Review availability, delivery timing, pricing and payment terms before you commit.
One Contact, Start to Finish
Work with one contact for your enquiry, delivery updates and order questions.