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K4A8G165WB-BCRC Samsung 8Gb DDR4 SDRAM

Samsung K4A8G165WB-BCRC is an 8Gb x16 DDR4 SDRAM component. This synchronous DDR4 component uses an 8n-prefetch architecture. Its controller configuration, electrical conditions and package must match the complete ordering code.

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K4A8G165WB-BCRC Specifications

Basic specifications

Manufacturer
Samsung
Complete part number
K4A8G165WB-BCRC
Memory type
DDR4 SDRAM
Component density
8Gb
Organization
512M x16
Data bus width
x16

Speed & electrical

Data rate
2400 MT/s
Clock
1200 MHz
CL / tRCD / tRP
17-17-17Native speed; limits and modes below.
VDD / VDDQ
1.2 V
VDD / VDDQ operating range
1.14–1.26 V
VPP
2.5 VOperating range: 2.375–2.750 V.

Package & temperature

Package
96-ball FBGA
Temperature option
Commercial (C)
Body size
7.50 ±0.10 × 13.30 ±0.10 mmW × L; manufacturer tolerances.
Body height
1.10 ±0.10 mm
Ball pitch
0.80 mm
Normal case range
0 to +85 °CMeasured at top center of the package.
Extended case range
>85 to +95 °CAdditional refresh and self-refresh conditions apply.
Technical notes & sources

Native timing. At DDR4-2400: 0.833 ≤ tCK < 0.937 ns; CL17, CWL 12 or 16. tAA 14.16–18 ns; tRCD and tRP ≥14.16 ns; tRAS ≥32 ns and ≤9 × tREFI; tRC ≥46.16 ns. DLL enabled. Gear-down disabled. Read DBI uses CL20; add 3nCK to the tAA limits. Use the supported CL/CWL/tCK combinations; optional lower-latency bins are not assumed.

Supply conditions. VDDQ must be ≤VDD and track VDD; AC characterization ties the rails. Keep VDD/VDDQ within 300 mV, VREFCA ≤0.6 × VDDQ (≤300 mV when both rails are below 500 mV), and VPP ≥VDD/VDDQ when powered. Absolute-maximum ratings are stress limits.

Rail measurement. The DC measurement bandwidth is limited to 20 MHz. Meet the operating ranges throughout operation; stress-rating tolerances do not replace them.

Temperature and refresh. In 1x refresh-command mode, tREFI is 7.8 µs through 85 °C and 3.9 µs above 85 °C through 95 °C. Above 85 °C, double the refresh-command frequency. If self refresh is used, manual extended-temperature mode is mandatory: MR2 A6=0, A7=1.

Manufacturer declaration: Samsung’s March 2025 declaration covers its Memory products placed on the EU market by Samsung and its subsidiaries, subject to the stated scope, concentration limits and exemptions. This does not certify a supplied lot or finished system.

K4A8G165WB-BCRC 96-ball FBGA manufacturer package outline

K4A8G165WB-BCRC Datasheet

Rev. 1.6 · Jun 2016

Specification review: 2026-11-06 · Related-part update: 2026-11-06.

96-ball FBGA · 7.50 ±0.10 × 13.30 ±0.10 mm Manufacturer drawing, not a product photo.

Selection notes

Can an existing DDR4-2400 initialization be reused?

Only after checking its timing and mode settings against this BCRC speed bin. A common data rate does not guarantee the same read latency or write-latency combination. Review CL, CWL and read-DBI together, and use the specified DLL-enabled, gear-down-disabled conditions. Then validate the resulting initialization on the intended controller and board.

Does a 96-ball footprint establish a board-level replacement?

No. Compare the board land pattern and clearance with the exact x16 package drawing, including body outline, ball pitch and ball assignment. A matching ball count is only an initial mechanical filter. Keep the package and pinout checks separate from the timing review before approving the device for an existing PCB.

Can a warm design use the normal refresh setup unchanged?

Once case temperature exceeds 85 °C, normal-refresh settings are no longer sufficient: the extended band requires double-frequency refresh. If the controller uses self refresh in that band, it must select the specified manual extended-temperature mode. Verify both the running and sleep configurations; a cooling test alone does not establish that the self-refresh setup is correct.

Is BCRC suitable when the board must start below 0 °C?

The commercial BCRC option does not establish that capability. If the application requires sub-zero operation, select and qualify a separately specified temperature option; do not transfer the datasheet’s industrial-family limits to BCRC. Preserve the temperature suffix in the BOM and quotation so purchasing cannot silently change the design’s thermal qualification.

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