K4A8G165WB-BCRC Samsung 8Gb DDR4 SDRAM
Samsung K4A8G165WB-BCRC is an 8Gb x16 DDR4 SDRAM component. This synchronous DDR4 component uses an 8n-prefetch architecture. Its controller configuration, electrical conditions and package must match the complete ordering code.
Availability, quantity and lead time are confirmed in your quotation.
K4A8G165WB-BCRC Specifications
Basic specifications
- Manufacturer
- Samsung
- Complete part number
- K4A8G165WB-BCRC
- Memory type
- DDR4 SDRAM
- Component density
- 8Gb
- Organization
- 512M x16
- Data bus width
- x16
Speed & electrical
- Data rate
- 2400 MT/s
- Clock
- 1200 MHz
- CL / tRCD / tRP
- 17-17-17Native speed; limits and modes below.
- VDD / VDDQ
- 1.2 V
- VDD / VDDQ operating range
- 1.14–1.26 V
- VPP
- 2.5 VOperating range: 2.375–2.750 V.
Package & temperature
- Package
- 96-ball FBGA
- Temperature option
- Commercial (C)
- Body size
- 7.50 ±0.10 × 13.30 ±0.10 mmW × L; manufacturer tolerances.
- Body height
- 1.10 ±0.10 mm
- Ball pitch
- 0.80 mm
- Normal case range
- 0 to +85 °CMeasured at top center of the package.
- Extended case range
- >85 to +95 °CAdditional refresh and self-refresh conditions apply.
Technical notes & sources
Native timing. At DDR4-2400: 0.833 ≤ tCK < 0.937 ns; CL17, CWL 12 or 16. tAA 14.16–18 ns; tRCD and tRP ≥14.16 ns; tRAS ≥32 ns and ≤9 × tREFI; tRC ≥46.16 ns. DLL enabled. Gear-down disabled. Read DBI uses CL20; add 3nCK to the tAA limits. Use the supported CL/CWL/tCK combinations; optional lower-latency bins are not assumed.
Supply conditions. VDDQ must be ≤VDD and track VDD; AC characterization ties the rails. Keep VDD/VDDQ within 300 mV, VREFCA ≤0.6 × VDDQ (≤300 mV when both rails are below 500 mV), and VPP ≥VDD/VDDQ when powered. Absolute-maximum ratings are stress limits.
Rail measurement. The DC measurement bandwidth is limited to 20 MHz. Meet the operating ranges throughout operation; stress-rating tolerances do not replace them.
Temperature and refresh. In 1x refresh-command mode, tREFI is 7.8 µs through 85 °C and 3.9 µs above 85 °C through 95 °C. Above 85 °C, double the refresh-command frequency. If self refresh is used, manual extended-temperature mode is mandatory: MR2 A6=0, A7=1.
Manufacturer declaration: Samsung’s March 2025 declaration covers its Memory products placed on the EU market by Samsung and its subsidiaries, subject to the stated scope, concentration limits and exemptions. This does not certify a supplied lot or finished system.
Manufacturer sources: Samsung 8Gb B-die x16 DDR4 Datasheet · Samsung DDR4 Product Guide · Samsung EU RoHS declaration

K4A8G165WB-BCRC Datasheet
Specification review: 2026-11-06 · Related-part update: 2026-11-06.
96-ball FBGA · 7.50 ±0.10 × 13.30 ±0.10 mm Manufacturer drawing, not a product photo.
Selection notes
Can an existing DDR4-2400 initialization be reused?
Only after checking its timing and mode settings against this BCRC speed bin. A common data rate does not guarantee the same read latency or write-latency combination. Review CL, CWL and read-DBI together, and use the specified DLL-enabled, gear-down-disabled conditions. Then validate the resulting initialization on the intended controller and board.
Does a 96-ball footprint establish a board-level replacement?
No. Compare the board land pattern and clearance with the exact x16 package drawing, including body outline, ball pitch and ball assignment. A matching ball count is only an initial mechanical filter. Keep the package and pinout checks separate from the timing review before approving the device for an existing PCB.
Can a warm design use the normal refresh setup unchanged?
Once case temperature exceeds 85 °C, normal-refresh settings are no longer sufficient: the extended band requires double-frequency refresh. If the controller uses self refresh in that band, it must select the specified manual extended-temperature mode. Verify both the running and sleep configurations; a cooling test alone does not establish that the self-refresh setup is correct.
Is BCRC suitable when the board must start below 0 °C?
The commercial BCRC option does not establish that capability. If the application requires sub-zero operation, select and qualify a separately specified temperature option; do not transfer the datasheet’s industrial-family limits to BCRC. Preserve the temperature suffix in the BOM and quotation so purchasing cannot silently change the design’s thermal qualification.
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