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H9HCNNNCPMMLXR-NEE — SK hynix 32Gb Dual-channel LPDDR4X

Review the complete NEE configuration before confirming a purchase line. The documented channel arrangement, package and temperature choice are separate from the current commercial offer.

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Total density
32Gb
Organization
two x16 channels
Data rate
4266 Mbps
Package
200-ball FBGA
Temperature
-25°C to 85°C

H9HCNNNCPMMLXR-NEE Specifications

Technical specifications for H9HCNNNCPMMLXR-NEE
Manufacturer / MPNSK hynix / H9HCNNNCPMMLXR-NEE
Memory family / total densityLPDDR4X / 32Gb
OrganizationTwo x16 channels; two chip selects per channel
Data rate4266 Mbps
Nominal suppliesVDD1 1.8V / VDD2 1.1V / VDDQ 0.6V
Package / NEE operating temperature200-ball FBGA / -25°C to 85°C

32Gb is the package total

The diagram shows four 8Gb dies arranged across two x16 channels with two chip selects per channel. A generic x32 label omits that control topology. Match the channel and chip-select wiring, not just capacity.

Preserve the NEE temperature choice

The ordering table lists NEE at -25°C to 85°C and NEI at -40°C to 95°C. Do not apply the NEI range to an NEE offer.

Ordering H9HCNNNCPMMLXR-NEE

Provide the quantity and destination. Add date-code, packing and delivery preferences when needed; “No preference” is acceptable. Ask for available label or lot photographs if the offered identity needs clarification. The manufacturer document describes the component; the quotation must identify the actual proposed supply.

The published 5,995 pcs remains an inventory snapshot, not a reservation. Confirm the allocation and written terms before ordering. The inventory date is not the technical-review date.

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