H5AG38EXNDX026N SK hynix 8Gb DDR4 SDRAM
SK hynix 8Gb DDR4 SDRAM, organized as 1G ×8, rated at 3200 MT/s in a 78-ball FBGA package. It is intended for main-memory applications requiring high memory density and high bandwidth.
As listed on DramTrade inventory. Final allocation and lead time are confirmed in quotation. Inventory source
H5AG38EXNDX026N Specifications
Basic specifications
- Manufacturer
- SK hynix
- Part number
- H5AG38EXNDX026N
- Memory type
- DDR4 SDRAM
- Density
- 8Gb
- Organization
- 1G ×8
- Data bus width
- 8-bit
Speed & electrical
- Data rate
- 3200 MT/s
- Clock at DDR4-3200
- 1600 MHzCalculated from tCK = 0.625 ns.
- Timing
- CL 22 · tRCD 22 · tRP 22Cycles at DDR4-3200, read DBI disabled.
- Nominal VDD / VDDQ
- 1.2V
- Operating VDD / VDDQ
- 1.14–1.26V
- VPP supply
- 2.5V typicalOperating range: 2.375–2.75V.
Package & temperature
- Package
- 78-ball FBGA
- Package dimensions
- 7.5 × 11 × (1.1 ±0.1) mmW × L × H; W/L ±0.1 mm; maximum height 1.2 mm.
- Ball pitch
- 0.8 mm
- Grade
- Commercial
- Normal case temp.
- 0°C to 85°C
- Extended case temp.
- 85°C to 95°CAbove 85°C, additional refresh conditions apply.
Technical notes & sources
Supply conditions. VDDQ must track VDD and not exceed it. VDD and VDDQ must remain within 300 mV of each other, and VPP must be at least VDD/VDDQ at all times. The listed voltage ranges are recommended operating limits, not absolute maximum ratings.
Timing conditions. 22–22–22 applies at DDR4-3200 with DLL on, read DBI disabled and Geardown disabled. tAA is 13.75–18 ns; tRCD and tRP are 13.75 ns minimum; tRAS is 32 ns minimum and tRC is 45.75 ns minimum. Other modes have different limits; both CL and CWL constraints must be met.
Temperature & refresh. Ratings refer to case temperature (Tcase), not ambient. In 1× refresh mode, tREFI is 7.8 µs at 0–85°C and 3.9 µs above 85°C up to 95°C. For those same ranges, 2× mode uses 3.9 / 1.95 µs and 4× mode uses 1.95 / 0.975 µs. Minimum tRFC is 350 / 260 / 160 ns in 1× / 2× / 4× mode. The extended operating range is labeled 85–95°C; the increased-refresh threshold is above 85°C.
Self-refresh caution. If self-refresh is used above 85°C, the documented manual extended-temperature setting is MR2[A7:A6] = 10. Optional Auto Self-Refresh needs clarification from SK hynix: its register encoding is inconsistent within Rev. 1.0. Do not infer the Auto setting from this page.
Manufacturer declaration: Lead-free, halogen-free and RoHS compliant, as stated in the datasheet (pp. 1, 3).
Manufacturer sources: SK hynix 8Gb DDR4 datasheet
H5AG38EXNDX026N Datasheet
Specification review: 2026-10-17 · Related-part update: 2026-10-20.
78-ball FBGA · x8 Manufacturer drawing, not a product photo.
Selection notes
What does H5AG38EXNDX026N mean?
In H5AG38EXNDX026N, H5A identifies DDR4; G3 is 8Gb; 8 is x8; E is E-die; XN is the DDR4-3200 speed code. D denotes commercial grade; the following X is reserved; 026 identifies an 8Gb, single-die, 78-ball configuration. The decoder does not define the final N. Keep the complete code in your BOM and RFQ.
Is H5AG38EXNDX026N industrial grade?
No. This part has the D commercial temperature code, not the J industrial code. Its normal case-temperature range is 0–85°C, with conditional operation up to 95°C. Increased refresh is required above 85°C; when self-refresh is used, an appropriate extended-temperature setting is also required. Optional Auto Self-Refresh needs manufacturer clarification. A 95°C limit does not establish industrial or automotive qualification.
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